聚合物基复合材料的界面结构与导热性能

赵维维 已出版文章查询
赵维维
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zww4610@163.com
1 傅仁利 已出版文章查询
傅仁利
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renlifu@nuaa.edu.cn
1 顾席光 已出版文章查询
顾席光
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1 王旭 已出版文章查询
王旭
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1 方军 已出版文章查询
方军
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1南京航空航天大学材料科学与技术学院,南京210016


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在整理近年来国内外对聚合物基导热复合材料性能的研究工作的基础上,总结界面结构与界面处理对聚合物基复合材料界面和导热性能的影响,分析目前已有研究中的缺点和不足,提出未来改善界面结合、提高聚合物基复合材料导热性能的具体方法,并指出探究界面结构与热流散射的关系,特别是弱界面结合情况下的热流传导规律,对提高聚合物基复合材料的热导率有很大的指导意义.

[1] Mamunya YP.;Davydenko VV.;Pissis P.;Lebedev E. .Electrical and thermal conductivity of polymers filled with metal powders[J].European Polymer Journal,2002(9):1887-1897.

[2] I.K. Bishay;S.L. Abd-El-Messieh;S.H. Mansour .Electrical, mechanical and thermal properties of polyvinyl chloride composites filled with aluminum powder[J].Materials & design,2011(1):62-68.

[3] JONG-WOO BAE;WONHO KIM;SUK-HYEON CHO .The properties of AlN-filled epoxy molding compounds by the effects of filler size distribution[J].Journal of Materials Science,2000(23):5907-5913.

[4] Yung KC;Liem H .Enhanced thermal conductivity of boron nitride epoxy-matrix composite through multi-modal particle size mixing[J].Journal of Applied Polymer Science,2007(6):3587-3591.

[5] Kinmura,Yesutaka .Phenolic resin molding materials with good thermal stability and flowability[P].JP,2005281356,2005-10-13.

[6] Mark J E.Physical properties of polymers handbook[M].New York,USA:Springer-Verlag,2007:155.

[7] Grimvall G.Thermophysical properties of Materials[M].Amsterdam,The Netherlands:Elsevier Science BV,1999:136.

[8] Pietralla M .High thermal conductivity of polymers:Possibility or dream[J].Journal of Computer-Aided Materials Design,1996,3(1-3):273.

[9] Wong C.P.;Bollampally S. .Thermal Conductivity,Elastic Modulus,and Coefficient of Thermal Expansion of Polymer Composites Filled with Ceramic Particles for Electronic Packaging[J].Journal of Applied Polymer Science,1999(14):3396-3403.

[10] Sanada K;Tada Y;Shindo Y .Thermal conductivity of polymer composites with close-packed structure of nano and micro fillers[J].Composites Part A:Applied Science and Manufacturing,2009,40(6-7):724.

[11] Hatsuo Ishida;Sarawut Rimdusit .Very high thermal conductivity obtained by boron nitride-filled polybenzoxazine[J].Thermochimica Acta,1998,320(1-2):177.

[12] Liang Qizhen;Moon Kyoung-Sik;Wong C P.High thermal conductive underfill materials for flip-chip application[A].Garmish-Partenkirchen,2008:162.

[13] Bigg D M.Metal-filled polymers[M].New York,USA:Marcel Dekker,Inc,1986

[14] 杨序刚.复合材料界面[M].北京:化学工业出版社,2010

[15] Pettersson S;Mahan G D .Theory of the thermal boundary resistance between dissimilar lattices[J].Physical Review B:Condensed Matter,1990,42(12):7386.

[16] Bryning MB;Milkie DE;Islam MF;Kikkawa JM;Yodh AG .Thermal conductivity and interfacial resistance in single-wall carbon nanotube epoxy composites[J].Applied physics letters,2005(16):1909-1-1909-3-0.

[17] Park C;Ounaies Z;Watson K A et al.Polymer-single wall carbon nanotube composites for potential spacecraft applications[J].Mater Res Soc Syrup Proc,2002,706:91.

[18] Y. XU;G. RAY;B. ABDEL-MAGID .Thermal behavior of single-walled carbon nanotube polymer-matrix composites[J].Composites, Part A. Applied science and manufacturing,2006(1):114-121.

[19] 吉元,钟涛兴,高晓霞,毋立芳,陈皓明,王秀凤,韩立,谢志刚.高导热电封装复合材料界面热传导的扫描热显微镜分析[J].电子显微学报,2001(03):238-243.

[20] Xu Y S;Chung D D L .Increasing the thermal conductivity of boron nitride and nitride particle epoxy-matrix composites by particle surface treatments[J].Composite Interfaces,2000,7(04):243.

[21] Wenyi Peng;Xingyi Huang;Jinhong Yu;Pingkai Jiang;Wenhao Liu .Electrical and thermophysical properties of epoxy/aluminum nitride nanocomposites: Effects of nanoparticle surface modification[J].Composites, Part A. Applied science and manufacturing,2010(9):1201-1209.

[22] Wei Cui;Feipeng Du;Jinchao Zhao .Improving thermal conductivity while retaining high electrical resistivity of epoxy composites by incorporating silica-coated multi-walled carbon nanotubes[J].Carbon: An International Journal Sponsored by the American Carbon Society,2011(2):495-500.

[23] Ulises Galan;Yirong Lin;Gregory J. Ehlert;Henry A. Sodano .Effect of ZnO nanowire morphology on the interfacial strength of nanowire coated carbon fibers[J].Composites science and technology,2011(7):946-954.

[24] Yirong Lin;Gregory Ehlert;Henry A. Sodano .Increased Interface Strength in Carbon Fiber Composites through a ZnO Nanowire Interphase[J].Advanced functional materials,2009(16):2661-2670.

[25] Kamthidaporn Wattanakul;Hathaikam Manuspiya;Nantaya Yanumet .The adsorption of cationic surfactants on BN surface:Its effects on the thermal conductivity and mechanical properties of BN-epoxy composite[J].Colloids and Surfaces A:Physicochemical and Engineering Aspects,2010,369(1-3):203.

[26] Liang Qizhen;Xiu Yonghao;Lin Wei.Epoxy/h-BN composites for thermally conductive underfill material[A].San Diego,California,USA,2009:437.

[27] Ishida H;Heights S .Surface treated boron nitride for forming a low viscosity high thermal conductivity polymer based boron nitride composition and method[P].US,6160042,2000-12-12.

[28] Yang Kai;Gu Mingyuan .Enhanced thermal conductivity of epoxy nanocomposites filled with hybrid filler system of triethylenetetra mine-functionalized multi-walled carbon nanotube/silane-modified nano-sized silicon carbide[J].Composites Part A:Applied Science and Manufacturing,2010,41(02):215.


语种: 中文   

基金国家自然科学基金(50872054)

关键词界面结构 聚合物基复合材料 表面处理 导热性能


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